XAGO12H | Hitachi Power Module

The structure and cooling system of conventional single-sided cooled power modules are described first. Conventional air-cooled single-sided cooled power modules have a semiconductor element, lead frame, insulation, and base plate layers on one side, and have a structure that dissipates the heat generated when the semiconductor element operates (see Fig. 4). Fig. 4 also shows the temperature distribution (obtained from a thermal fluid simulation) of a cooling system using a conventional single-sided cooled power module and air-cooling fins. This temperature distribution shows that heat is not sufficiently dispersed up to the edges of the heat-dissipating fins, and the fins have portions