MC472 | MC472A BN624A794G53C Mitsubishi CIRCUIT BOARD

The efficient design of the power stage and the control signal interface realizing the design targets oflow inductive connections and avoiding crossing of signal and high voltage traces- on only two layers becamepossible by matching pin terminal layout of the HVIC and S1-Series NX Package 6in1IGBT modules.Suitableground planes were realized bottom layer. For wide temperature range and robustness during the solderingprocess a FR4 epoxy based material has been chosen.The design of the top layer (Cu traces in red color) contains the desaturation diodes, the bootstrap circuit diodesand resistors, snubber capacitors,NTC interface pinheader along with control interface pinheader and powerterminal connectors.A part of the silk screen for component placement information is shown in this view to easethe orientation.