8002-4192 | Kulicke & Soffa I/O TEMP BOARD

Features:
High First Pass Yields at Fine Pitch
Efficient Space and Facilities Utilization
Low Cost and Fast Ball Size Changeovers Requiring No Major Tooling
Cold Processes Requiring Only Localized Heating of Individual Pads
The K&S Model 9388 LaserPro is designed to attach solder balls to integrated circuit (IC) devices. The machine attaches a ball by placing it on a device bond pad, then irradiating it with laser light. The light heats the ball to a temperature sufficient to reflow the solder, thereby attaching the ball to the bond pad.